EIAJ ED 4701 PDF

JEITA EIAJ Standards (as of August in ). General System, Category and Title , Spec. No. (Test No.) Life Test, JEITA EIAJ ED/ Life TestⅠ, Steady. Japan Electronics and Information Technology Industries Association (JEITA) Standards EIAJ ED/ Environmental and endurance test methods for. EIAJ ED/ Test Method Ta=85°C, 85%RH, Vcc=80V, Vdd=6V. hrs. 0/ AC. EIAJ ED B Ta=°C,%RH.

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But, the new endurance test methods become to 2 kinds of specific test methods that are endurance test and intermittent operation life test. Atsushi Natsume Sony Corp. Toshiki Yamaguchi Fujitsu Ltd. Tetsuji Matsuura Toshiba Corp. Toru Katou Sanyo Electric Co.

JEITA ED is a standard for “environmental and endurance test methods for semiconductor devices”, and describes testing methods for evaluating semiconductor devices for industry and consumers. In conformity the relevant specifications when the specimen is cooled by forced convection.

The ambient temperature when the specimen is stored in inoperative state. The standards related to integrated circuits IC and separate volume Appendix had been published, and the standards related to discrete devices SD separate volume Appendix and separate volume Appendix had been published. The temperature at the reference point specified in the relevant specifications. In particular, utmost attention should be paid to the precautions indicated in the detail specifications.

When the specimen has outward appearance different from those ones shown in the figures, its directions are defined in the relevant specifications.

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3-3 Standards Related to Reliability Test |Sanken Electric

The junction temperature of the specimen. JEITA standards are established independently to any existing patents on the products, materials or processes they cover. Back to the main subject. Eixj treatment which the specimens are submitted to before carrying out the initial measurements and tests. The temperature on the surface of the specimen at the point specified in the relevant specifications.

Reliability Evaluation Fee

Semiconductor device wikipedialookup. Below are listed the members of deliberation of this standard. The life tests and the strength tests was subdivided according to the revision frequency. Mechanical test methods B: What are SiC Schottky barrier diodes? Because SiC does not have a long history as a semiconductor material, and because it does not have much of a track record compared with Si power devices, there may not be much awareness of the level of its reliability.

Portable appliance testing wikipedia eiajj, lookup Electromagnetic compatibility wikipedialookup Semiconductor device wikipedialookup. Reliability of SiC-SBDs Because SiC does not have a long history as a semiconductor material, and because it does not have much of a track record compared with Si power devices, 44701 may not be much awareness of the level of its reliability.

The 4 Appendixes confused the newest specification searching. Thank riaj for your participation! Electromagnetic compatibility wikipedialookup. The visual inspection and the electrical and optical measurements that are carried out after finishing the tests. By continuing to browse this website without changing your web-browser cookie settings, you are agreeing to our use of cookies.

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There is a tendency for people to be hesitating over things that are new and untested. However, the reader can consider the data that we shall present below. Indicates the value under ordinary operating conditions. In other words, from the above reliability data we can see that the ROHM SiC-SBDs subjected to evaluations have demonstrated satisfactory reliability in the familiar same tests used for reliability testing of Si transistors and ICs. Main revision points are as follow.

Hiroyoshi Odaira Seiko Epson Corp. The treatment which the specimens are submitted to before carrying out the end-point measurements with the object eliminating all factors except the influence exerted by the tests in question.

NPC Reliability Testing

The semiconductor devices that are made with the object of being mounted on printed circuit boards by means of the surface mounting method. The pre-treatment, equivalent to the humidity absorption which occurs during the storage period until the actual mounting by soldering, which the specimens are submitted to before the soldering process.

Portable appliance testing wikipedialookup. Junichi Mitsuhashi Mitsubishi Electric Corp. Miscellaneous test methods 2 Endurance tests Test by devices D: The semiconductor devices provided for the tests.

Naohiro Yasuda Fuji Electric Co. JEITA assumes absolutely no responsibility toward parties applying these standards or toward patent owners. Osamu Nakayama Kawasaki Microelectronics, Inc.